HFB03 Series

Features

• Surface mount EMI suppression components.
• Nickel barrier termination for excellent resistance to solder heat.
• Offers Impedance performance at high frequencies.
• Multi layer technology.
• Flow and reflow soldering.

Electrical

• Impedance Range:
  HFB03 600 to 1000Ω.
  HFB05 470 to 1500Ω.
• Tolerance: 25% over entire range.
• Operating Temp: -55ºC ~ +125ºC.
• Storage Temp: Under 25ºC at 40~60% Humidity.
• Rate Current: Based on temp rise not to exceed 30ºC.

Resistance to Solder Heat

• Pre-Heat 150ºC, 1 minute.
• Solder Composition: Sn/Ag3.0/Cu0.5.
• Solder Temp: 260±5ºC for 10sec ±1 sec.
• Minimum of 75% of Electrode covered with new solder.
• Impedance within 30% of initial value.

Test Equipment

• (Z): HP4291A RF Impedance/Material Analyzer.
• (RDC): Chen Hwa 502BC

Physical

• Packaging:
  HFB03 10000 pieces per 7 inch reel.
  HFB05 4000 pieces per 7 inch reel.
• Marking: None