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Allied Components

HCB03 Series

$0.00

Features

  • 0402 Surface mount EMI supression components.
  • Nickel barrier termination for excellent resistence to solder heat.
  • High current capacity.
  • Wide range of impedance values.
  • Multi layer technology.
  • Low DCR.
  • Flow and reflow soldering.

Electrical

  • Impedance Range: HCB03 10Ω to 1000Ω
  • Tolerance: 25% over entire range.
  • Operating Temp: -55ºC ~ 125ºC.
  • Storage Temp: Under 25ºC at 40 ~ 60% Humidity.
  • Rate Current: Based on temp rise not to exceed 30ºC.
    Rated current is directed as indicated below based on operating temp.

Resistance to Solder Heat

  • Pre-Heat 150ºC, 1 minute.
  • Solder Composition: Sn/Ag3.0/Cu0.5
  • Solder Temp: 260±5ºC for 10sec ±1 sec.
  • Minimum of 75% of Electrode covered with new solder.
  • Impedance within 30% of initial value.

Test Equipment

  • (Z): HP4291A RF Impedance/Material Analyzer.
  • (RDC): Chen Hwa 502BC.

Physical

  • Packaging: 100000 pcs per 7 inch reel.
  • Marking: None
Part Number

Specifications
  • Rated Current: 2000mA
  • DCR Max: 0.0300Ω
  • Op Temp Range: -55°C to +125°C
  • Length: 0.039 / 0.991
  • Width: 0.020 / 0.508
  • Height: 0.020 / 0.508
  • Impedance: 10Ω
    • Download Datasheet

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